Riverside Research Hosted First Plasma Science and Technology Technical Interchange Meeting
DAYTON, OH—Riverside Research, a not-for-profit company primarily serving the Department of Defense (DOD) and the Intelligence Community (IC), hosted its first Plasma Science and Technology Technical Interchange Meeting on 16 November at its Dayton Research Center. This first meeting was by invitation-only, bringing together the company’s plasma experts with scientists from academia, industry, the Air Force Research Laboratory (AFRL), and other government agencies.
The goal of the meeting was to develop a better understanding of the mechanisms responsible for the effects of plasma on propagation and scattering of electromagnetic waves. Along with Riverside Research, members from AFRL, Eastern Michigan University, and Voss Scientific presented plasma-related studies. There were a total of seven presentations throughout the day. The research that was presented is significant to the defense industry and has applications across several domains including communication, navigation, and the performance of sensors.
“The event provided attendees with a forum to discuss their latest research and interact with colleagues,” said Riverside Research Open Innovation Center Director, Dr. Jeffrey Pursel. “It encouraged the potential for future partnerships and collaborations in plasma research across government, industry, and academia.”
At the conclusion of the meeting, attendees toured Riverside Research’s Open Innovation Center, which houses dedicated laboratory spaces to perform research in plasma, machine learning, cyber, electromagnetics, optics, and radio frequency systems. This first meeting was such a success that the company is already planning to host the event again next year and open it to other members of government, industry, and academia. For more information about upcoming Riverside Research Plasma Science and Technology Technical Interchange meetings, please contact Dr. Christopher Plechaty at firstname.lastname@example.org.