Dr. Steven Omick is President and CEO of Riverside Research. He has over 28 years of research and executive leadership experience in the private sector and defense and intelligence industries.
During his tenure at Riverside Research, Dr. Omick has focused on the goal of building a research and development portfolio with mission impact in the National Security arena. Central to that goal is the formalization of the innovation engine for the company – The Open Innovation Concept, or OIC. Under this independent R&D framework, Riverside Research is investing in AI/ML, Secure and Resilient Systems, Optics, Electromagnetics, RF Systems, and Commercial ISR.
Prior to joining Riverside Research, Dr. Omick was President of Applied Communications Sciences (ACS), where he led customer growth at DARPA and with other National Security R&D customers. He also established a framework for the commercialization of intellectual property and facilitated the integration of ACS into its parent company, Vencore.
Before that, Dr. Omick was President and CEO of Rincon Research Corporation (RRC), a leading provider of digital signal processing products and engineering services for the US government intelligence community. He first joined RRC in 1996 as a research engineer designing, developing, and fielding prototype digital communications capabilities.
A published author in the field of computational electromagnetics, Dr. Omick also served on the faculty of New Mexico State University where he taught electrical engineering courses and led research programs.
Dr. Omick holds a B.S. in electrical engineering, an M.S. specializing in power and control systems, and a PhD in computational electromagnetics from New Mexico State University.
The functional electromagnetic materials independent research and development (IRAD) efforts at Riverside Research result in big ideas about small components. The researchers on this team examine the materials at the basis of every hardware component or device in use, reimagining how we can use alternative materials or new materials to help the device function more safely, securely, and cost effectively – all while taking up less physical space.
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